MicroStructural Studies Unit and Surface Analysis Laboratory

In the field of electron microscopy, we use a mixture of imaging techniques to characterise materials including both in-lens and out-lens secondary and backscatter electron detection alongside complementary X-ray microanalysis techniques including energy dispersive spectroscopy (EDS or EDX), wavelength dispersive spectroscopy (WDS) and electron backscatter diffraction (EBSD) for advanced characterisation.

For surface analysis, our XPS and ToF-SIMS instruments offer the ability to accurately determine the chemical composition and provide chemical state/bonding information from the top 5-10 nanometers at the surface.

To probe deeper, we have capability of performing ion beam sputter depth profiles, important in the chemical analysis of thin film devices or corrosion products, for example.

There is also the ability to undertake small area analysis with XPS (down to 30 µm) and perform ToF-SIMS imaging. For the analysis of interfaces, we offer an in-situ fracture stage and other bespoke methods to access buried layer or substrates.

Our atomic force microscopy and mechanical profilometry instruments offer the ability to study the surface topography of materials with ultra-fine depth resolution (<1 nm).

The software provides a rapid assessment of surface roughness and feature heights, important for quality control, contamination and other industrial applications.

The Thermo Scientific Apreo FEG-SEM offers high-performance imaging and X-ray analysis. The ultimate spatial resolution is approximately 1 nm. Resulting from developments in low-voltage imaging technology, the Apreo can image beam-sensitive materials at accelerating voltages as low as 200 V and a current of 1.6 pA.

This enables high quality imaging of nanomaterials, plastics/polymers and other beam-sensitive materials, such as perovskites. The Apreo chamber has also been designed to allow for large specimens to be examined, useful for industrial component analysis.

The Thermo Scientific ChemiSEM Technology provides a unique live elemental imaging capability, with quantified EDS compositional information being readily and quickly accessed through an easy-to-use interface. A range of external and in-lens detectors can display secondary, backscattered electron and EDS imaging simultaneously, giving excellent resolution across a wide range of accelerating voltages and providing a combination of analyses allowing a rapid assessment of material.

The JEOL JSM-7100F is a highly versatile, easy-to-use analytical field emission gun scanning electron microscope (FEG-SEM). It has a spatial resolution of 1.2 nm at 30 kV. The MSSU microscope is fitted with a ThermoScientific triple analysis system, featuring an UltraDry EDS detector, a MagnaRay parallel beam WDS spectrometer and a Lumis system for electron backscatter diffraction (EBSD).

All three analytical functions are integrated into a single ThermoScientific data system called Pathfinder to allow integration between these three complementary techniques.

The ThermoScientific Talos 200Fi is capable of both transmission (TEM) and scanning transmission (STEM) analysis. It is equipped with a high brightness FEG source (XFEG) and a high-resolution XTWIN lens, allowing single angstrom imaging resolution.

Images are captured on a direct-electron detector camera (Ceta 16M, with up to 4k x 4k pixels) and smart acquisition routines, such as drift-compensated frame integration.

In STEM mode, a Panther segmented STEM detector allows five simultaneous imaging modes, with complementary morphological and structural information about the sample. Elemental information can be mapped with nearly atomic resolution using a Dual X EDX system, which also designed for efficient collection during tomography.

Thermo Scientific K-Alpha XPS instrument is equipped with a monochromated Al ka X-ray source and variable spot size between 30 and 400 µm. Depth profiling is performed using Thermo's MAGCIS dual-mode monatomic and gas cluster ion source, enabling rapid profiling through inorganic and organic materials.

The 180° double focusing hemispherical analyser with 128-channel detector delivers excellent signal-to-noise spectra, enabling a high throughput of samples whilst also generating high quality chemical state information.

The Advantage software offers state-of-the-art peak fitting of the core level spectra and rapid, accurate qualification of the chemical composition.

The Theta Probe is specifically designed to offer parallel angle resolved XPS (PARXPS) capability enabling the acquisition of non-destructive depth profiles of thin films. This instrument also offers a small spot (15-400 µm) capability for its monochromated Al ka X-ray source and an argon ion gun for depth profiling.

The instrument is also equipped with a preparation chamber which may be used for a range of in-situ (e.g. fracture stage) and other in-vacuo sample preparation procedures.

A ToF-SIMS instrument incorporating a polyatomic Bi ion source offering excellent sensitivity, high spatial and good mass resolution capabilities. Additional Cs and C₅₀ ion sources are installed on this instrument as sputter depth profiling sources although they may also be employed as analysis sources. The instrument offers an ultimate spatial resolution of <100 nm and detection limit of <10 ppm.

Our ToF-SIMS V includes a preparation chamber which may be used for a rnage of in-situ and in-vacuo experiments and sample preparation procedures. In-situ stages for impact and controlled strain rate testing of materials are currently installed on the preparation chamber. The instrument also possesses heating and colling stages in the entry lock and analysis chamber.

Our Bruker Dimension Edge AFM system offers the low drift and low noise capabilities to deliver high quality topographical information in minutes. This instrument includes the PeakForce tapping mode, enabling simple and accurate analysis of delicate samples and various analytical modes, such as conductive AFM imaging and Kelvin Probe measurements.

The ScanAsyst imaging includes integrated visual feedback and pre-configured settings enabling high quality results to be rapidly and simply recorded.

The Bruker DektakXT stylus profilometer is an advanced stylus profilometer that offers a height measurement sensitivity of 4 Å over a distance of up to 160 mm. The integrated software collects accurate step height and quantifies surface roughness, ideal for rapid thin film and sputter crater measurements.

Easy to use top-range digital optical microscope with variable magnification up to 4000x. Can be operated using reflected or transmitted light. Variety of segmented coaxial or ring lamp illumination with 3-axis stage movement to provide larger area high resolution tile scans and/or 3-D information.

Polarising and Differential Image Contrast (DIC) options available. Post processing options for dimensional measurements, contamination/grain size/shape analysis. Surface topology, including waviness and roughness, can be investigated.

The unit has cutting equipment to prepare specimens of various sizes and all material types with high degree of accuracy and minimising any heat affection. We have the ability to mount samples for analysis in epoxy resin, Bakelite thermoset plastic and acrylics.

The samples are then prepared using our modern grinding and polishing kit capable of preparation of metallics, ceramics, polymers, and minerals to a sub-micron finish. The techniques we employ include semi-automatic grinding and polishing on an array of abrasive clothes and discs. We have vibro-polishing which is perfect for improving EBSD pattern quality and more. All performed by highly trained metallographic preparation technical staff. We can also chemically etch for microstructural analysis. All such work is performed by technical staff trained in metallographic preparation.

We have a variety of hardness testing apparatus which can support industry clients in a range of applications from failure analysis to quality assurance testing. We have the capability to perform both macro and micro Vicker’s hardness testing, Knoop hardness testing, and Rockwell hardness testing.

Please talk to a member of the team if you want to discuss specific applied loads during testing.